System-on-chip (SoC) design challenges - managing non-technical issues

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Title: System-on-chip (SoC) design challenges - managing non-technical issues
Author: Kini, Kuntadi Nitin
Abstract: Efforts to increase productivity , reduce time to market , reduce costs and desire for increased functionality on a chip are driving semiconductor companies to consider SoC (System -on -a -chip ) design . SoC offers the additional benefit of improving performance and design freedom . SoC designs are smaller , energy efficient and cheaper than the multi -chip solutions . Silicon manufacturing technology has improved to an extent where one can create a reliable chip with millions of transistors . Design of these complex systems , on the other hand , is taking longer and is much costlier even when the technology allows integration of the million transistor chips . Keeping these design costs low and reducing development cycle time is vital for any chip design company . Hence , companies need to delicately balance the design costs versus benefits for SoC design . Design turn -around time (TAT ) even for large complex designs has been significantly improved by EDA tools despite the complexity added by the ever shrinking device geometries . However , other non technical issues and external dependencies in SoC design such as working with multi -disciplinary design teams , external IP (Intellectual Property ) vendors , Electronic Design Automation (EDA ) tool vendors and IP protection issues increase the risk of missing project goals and timeline . This paper will address both the technical and non -technical issues that arise when moving to SoC design and provide recommendations on how to address some of the non -technical issues involved .
URI: http : / /hdl .handle .net /2152 /ETD -UT -2009 -08 -211
Date: 2010-06-04

Citation

System-on-chip (SoC) design challenges - managing non-technical issues. Master's thesis, The University of Texas at Austin. Available electronically from http : / /hdl .handle .net /2152 /ETD -UT -2009 -08 -211 .

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