Simulation of three-dimensional laminar flow and heat transfer in an array of parallel microchannels

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dc.contributor.advisor Anand , N . K . en_US
dc.contributor.committeeMember Han , Je C . en_US
dc.creator Mlcak , Justin Dale en_US
dc.date.accessioned 2010 -01 -14T23 :55 :37Z
dc.date.accessioned 2014 -02 -19T19 :38 :18Z
dc.date.available 2010 -01 -14T23 :55 :37Z
dc.date.available 2014 -02 -19T19 :38 :18Z
dc.date.created 2007 -05 en_US
dc.date.issued 2009 -05 -15 en_US
dc.identifier.uri http : / /hdl .handle .net /1969 .1 /ETD -TAMU -1671
dc.description.abstract Heat transfer and fluid flow are studied numerically for a repeating microchannel array with water as the circulating fluid . Generalized transport equations are discretized and solved in three dimensions for velocities , pressure , and temperature . The SIMPLE algorithm is used to link pressure and velocity fields , and a thermally repeated boundary condition is applied along the repeating direction to model the repeating nature of the geometry . The computational domain includes solid silicon and fluid regions . The fluid region consists of a microchannel with a hydraulic diameter of 85 .58 ?m . Independent parameters that were varied in this study are channel aspect ratio and Reynolds number . The aspect ratios range from 0 .10 to 1 .0 and Reynolds number ranges from 50 to 400 . A constant heat flux of 90 W /cm2 is applied to the northern face of the computational domain , which simulates thermal energy generation from an integrated circuit . A simplified model is validated against analytical fully developed flow results and a grid independence study is performed for the complete model . The numerical results for apparent friction coefficient and convective thermal resistance at the channel inlet and exit for the 0 .317 aspect ratio are compared with the experimental data . The numerical results closely match the experimental data . This close matching lends credibility to this method for predicting flows and temperatures of water and the silicon substrate in microchannels . Apparent friction coefficients linearly increase with Reynolds number , which is explained by increased entry length for higher Reynolds number flows . The mean temperature of water in the microchannels also linearly increases with channel length after a short thermal entry region . Inlet and outlet thermal resistance values monotonically decrease with increasing Reynolds number and increase with increasing aspect ratio . Thermal and friction coefficient results for large aspect ratios (1 and 0 .75 ) do not differ significantly , but results for small aspect ratios (0 .1 and 0 .25 ) notably differ from results of other aspect ratios . en_US
dc.format.medium electronic en_US
dc.format.mimetype application /pdf en_US
dc.language.iso en _US en_US
dc.subject Microchannel en_US
dc.title Simulation of three -dimensional laminar flow and heat transfer in an array of parallel microchannels en_US
dc.type Book en
dc.type.genre Electronic Thesis en_US
dc.type.material text en_US
dc.format.digitalOrigin born digital en_US

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Simulation of three-dimensional laminar flow and heat transfer in an array of parallel microchannels. Available electronically from http : / /hdl .handle .net /1969 .1 /ETD -TAMU -1671 .

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