Development Of An Experimental And Analytical Model Of An Active Cooling Method For High-power Three-dimensional Integrated Circuit (3D-IC) Utilizing A Multidimensional Configured Thermoelectric Modules

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Title: Development Of An Experimental And Analytical Model Of An Active Cooling Method For High-power Three-dimensional Integrated Circuit (3D-IC) Utilizing A Multidimensional Configured Thermoelectric Modules
Author: Phan, Huy
Abstract: An increase in demand for more functionality and capacity of microelectronic components within the same logistic footprint drives the growth of three -dimensional integrated circuit (3D -IC ) packaging technologies in recent years . However , the reduction in size and an increase in transistors density also intensified the heat flux of stacked -dice , which introduces many thermal challenges at both the package and cooling levels . Traditional passive cooling system such as forced air convection cooling , phase change materials and passive or active heat sinks will become inadequate to cool future processors and cannot accommodate the demand of future sub -ambient cooling of 3D -ICs . Within the past 10 years , major microprocessor manufactures have shifted their focuses toward higher bandwidth rather than frequency ; however , the heat flux of current high -end CPU and GPU on the same die with parallel sequential computation is still in the order of 70 to 75 W /cm2 with local heat flux exceeding 1 .5W /mm2 and growing . Today , stack -dice are used widely as low -powered memory applications because thermal management of such 3D architectures as high -powered processors inherits many thermal challenges and very costly . Heat dissipation of 3D -IC is highly non -uniform and non -unidirectional due to many factors such as material properties , power architectures , power leakage , transistor packing density , and real estate available on the processor . Inadequate thermal management of these systems leads to reduction in reliability , performance and ultimately a system's catastrophic failure . In this study , an experimental , an analytical , and a thermal cycling of an active cooling method for three -dimensional integrated circuits utilizing a multidimensional configured thermoelectric cooler were investigated . In addition , an alternative method to analyze thermoelectric cooling system employing a Modified -Graphical -Method (MGM ) to eliminate the need of using proprietary fabrication information was also studied .
URI: http : / /hdl .handle .net /10106 /5827
Date: 2011-07-14

Citation

Development Of An Experimental And Analytical Model Of An Active Cooling Method For High-power Three-dimensional Integrated Circuit (3D-IC) Utilizing A Multidimensional Configured Thermoelectric Modules. Available electronically from http : / /hdl .handle .net /10106 /5827 .

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